february 2012 doc id 022075 rev 1 1/10 10 esdaly automotive dual transil? array for esd protection features dual unidirectional transil functions low leakage current: i r max. < 20 a at v br 300 w peak pulse power (8/20 s) benefits high esd protection level: up to 25 kv high integration suitable for high density boards aec-q101 qualified complies with the following standards iso 10605: c = 150 pf, r = 330 ? 30 kv (air discharge) ? 30 kv (contact discharge) iso 10605: c = 330 pf, r = 330 ? 30 kv (air discharge) ? 30 kv (contact discharge) iso 7637-2 (a) ? pulse 1: v s = -100 v ? pulse 2a: v s = +50 v ? pulse 3a: v s = -150 v ? pulse 3b: v s = +100 v applications where transient overvoltage protection in esd sensitive equipment is required, such as: entertainment signal communications connectivity comfort and convenience figure 1. functional diagram description the esdaly is a monolithic array designed to protect 1 line or 2 lines against esd transients. the device is ideal for applications where both reduced line capacitance and board space saving are required. it can also be used as bidirectional suppressor by connecting only pin 1 and 2. tm : transil is a trademark of stmicroelectronics. a. not applicable to parts with stand-off voltage lower than the average battery voltage (13.5 v) sot23-3l 1 2 3 1 2 3 www.st.com
characteristics esdaly 2/10 doc id 022075 rev 1 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage (1) iso 10605 (c = 330 pf, r = 330 ): contact discharge air discharge iso 10605: c = 150 pf, r = 330 contact discharge air discharge 30 30 30 30 kv p pp peak pulse power (8/20s) 300 w i pp peak pulse current (8/20s) ESDA5V3LY esda6v1ly esda14v2ly esda25ly 25 18 14 7 a t j operating junction temperature range -40 to 150 c t stg storage temperature range -65 to +150 c t l maximum lead temperature for soldering during 10 s at 5 mm from case 260 c 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = peak pulse current i = breakdown current br rm rm rm pp r v = clamping voltage i = forward current r = dynamic resistance t = voltage temperature coefficient c = line capacitance cl pp d line i v v f i f i rm i r i pp v rm v br v cl slope = 1/r d
esdaly characteristics doc id 022075 rev 1 3/10 table 2. electrical characteristics (values, t amb = 25 c) order code v br @ i r i rm @ v rm v cl @i pp (1) v f @ i f r d (2) t (3) c line min. max. max. max. max. typ. max. typ. v v ma a v v a v ma m 10 -4 /c pf ESDA5V3LY 5.3 5.9 1 2 3 19 25 1.25 200 280 5 220 esda6v1ly 6.1 7.2 1 20 5.2 16 18 1.25 200 350 6 140 esda14v2ly 14.2 15.8 1 5 12 21 14 1.25 200 650 10 90 esda25ly 25 30 1 1 24 43 7 1.2 10 1000 10 50 1. 8/20 s waveform 2. square pulse, i pp = 15 a, t p = 2.5 s. 3. v br = t* (t amb - 25 c) * v br (25 c) figure 3. variation of peak pulse power versus initial junction temperature figure 4. peak pulse power versus exponential pulse duration (typical values) 0.0 200.0 400.0 600.0 0 25 50 75 100 125 150 175 t j (c) p pp (w) 10 100 1000 10000 1 10 100 1000 t j initial = 25 c t p (s) p pp (w) figure 5. variation of clamping voltage versus peak pulse current (max. values, 8/20 s waveform) figure 6. relative variation of leakage current versus junction temperature (typical values) 0.1 1.0 10.0 100.0 0 4 8 12 16 20 24 28 32 36 40 44 8/20s t j initial = 25 c ESDA5V3LY esda6v1ly esda14v2ly esda25ly i pp (a) v cl (v) 0.0 0.1 1.0 10.0 100.0 1000.0 10000.0 25 50 75 100 125 150 ESDA5V3LY (v r =v rm =3v) esda6v1ly (v r =v rm =5.2v) esda14v2ly (v r =v rm =12v) esda25ly (v r =v rm =24v) t j (c) i r (na)
characteristics esdaly 4/10 doc id 022075 rev 1 note: iso7637-2 pulse responses are not applicable for products with a breakdown voltage lower than the average battery voltage (13.5 v) like ESDA5V3LY and esda6v1ly. figure 7. iso 7637-2 pulse 1 response (v s = -100 v) figure 8. iso 7637-2 pulse 2a response (v s = 50 v) figure 9. iso 7637-2 pulse 3a response (v s = -150 v) figure 10. iso 7637-2 pulse 3b response (v s = 100 v)
esdaly application and design guidelines doc id 022075 rev 1 5/10 2 application and design guidelines more information is available in the application note: an2689, ?protection of automotive electronics from electrical hazards, guidelines for design and component selection?. 3 ordering information scheme figure 11. ordering information scheme esda xxx ly esd array minimum breakdown voltage package l = sot23-3l y = automotive grade
package information esdaly 6/10 doc id 022075 rev 1 4 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 12. footprint (dimensions in mm) table 3. sot23-3l dimensions ref. dimensions millimeters inches min. max. min. max. a 0.89 1.4 0.035 0.055 a1 0 0.1 0 0.004 b 0.3 0.51 0.012 0.02 c 0.085 0.18 0.003 0.007 d 2.75 3.04 0.108 0.12 e 0.85 1.05 0.033 0.041 e1 1.7 2.1 0.067 0.083 e 1.2 1.6 0.047 0.063 h 2.1 2.75 0.083 0.108 l 0.6 typ. 0.024 typ. s 0.35 0.65 0.014 0.026 a1 a l h b e d e e1 s c 0.95 0.61 1.26 3.25 0.73
esdaly recommendation on pcb assembly doc id 022075 rev 1 7/10 figure 13. tape and reel specifications 5 recommendation on pcb assembly 5.1 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder paste with fine particles: powder particle size is 20-45 m. 5.2 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 1.24 3.1 0.21 2.1 2.9
recommendation on pcb assembly esdaly 8/10 doc id 022075 rev 1 5.3 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 5.4 reflow profile figure 14. st ecopack? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 60 sec (90 max) 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 -2 c/s to -3 c/s -6 c/s max 240-245 c 2 - 3 c/s 0.9 c/s temperature (c) time (s)
esdaly ordering information doc id 022075 rev 1 9/10 6 ordering information 7 revision history table 4. ordering information order code marking (1) 1. the marking can be rotated by multiples of 90 to differentiate assembly location package weight base qty delivery mode ESDA5V3LY el5y sot23-3l 8.7 mg 3000 tape and reel esda6v1ly el6y esda14v2ly el1y esda25ly el2y table 5. document revision history date revision changes 16-feb-2012 1 initial version. this document merges and updates the content of the datasheet esda25ly revision 1, 01-feb-2010.
esdaly 10/10 doc id 022075 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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